Semiconductor integrated circuits (ICs) are critical in a wide range of products. They provide the essential technology to run everything from a simplest calculator to the fastest computers. Probe card repair are an integral part of the IC testing process. Their reliability is key to ensuring the success of the entire IC test process.

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Semiconductor Integrated Circuits (ICs) are essential in the modern world, from the simplest calculator to the fastest computer. They require high precision testing and measurement in order to work properly.

Probe card repair are at the center of this testing process. These probes are positioned over the bond pads on a wafer to make contact and generate test signals, which are then used to determine whether an IC has been made correctly.

Alignment

Alignment is a key part of the process that enables probe cards to be positioned in accordance with the bonding pads on integrated circuits. Misalignment can cause the probe tips to miss the pad and cause damage to the protective oxide layer surrounding the pad.

Conventional methods for identifying planarity have included a metal plate held parallel to the probe card. The position of the metal plate as it incrementally moves along a Z-axis is used to determine the height of each probe tip from the surface of the probe card.

However, there is a problem with conventional systems that use this method to identify probes that are out of XY alignment. Because of the small dimensions of a probe, it is difficult to determine the Z height of each probe from the surface of the probe card repair using this method.

Passivation

Stainless steel has a natural ability to resist corrosion, but fabrication, machining and welding processes introduce contaminants into the surface that inhibit this process. Passivation is a chemical process that removes these contaminants and enhances the corrosion resistance of the metal.

The process involves immersing a stainless steel part in an acid bath at a specific concentration and temperature to dissolve free iron particles from the metal’s surface. This leaves a layer of metal with a higher percentage of chromium than the underlying material, creating a thicker and more protective chromic oxide layer that protects the stainless steel from corrosion.

Nitric acid is the most common method used to passivate stainless steel, but citric acid is also a viable option. Citric acid is safer than nitric acid and doesn’t pose the same health and safety risks. However, some stainless steel alloys are more difficult to passivate with citric acid because of their higher carbon content or ferritic structure.

Epoxy

Epoxy is a durable, high-temperature conductive material that has a long history of dependable performance in prober cards. Its chemical resistance and low leakage properties help ensure accurate probing and reduced maintenance costs.

During testing, epoxy pads are normally subjected to abrasion and vibration, both of which can cause the pad surface to scuff, scratch, or otherwise damage the bond pad. This damage can result in misalignment or planarization problems.

In addition, abrasion can damage the probe tip. This can result in a convex or concave etch, which reduces the strength of the tip and causes it to curl over time.

A good quality sanding machine can help minimize this problem. However, sanding should be done with care and in a well-ventilated area to avoid injury. Alternatively, a non-hazardous chemical solvent can be used to clean the probe tip. This can also be a cost-effective alternative to abrasive pads. But, be sure to use PPE when handling chemicals and solvents.